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DYNA-PURGE® K
Product Information Sheet
“Dual Power” cleaning for a broad range of low-temp resins
DYNA-PURGE K is a low-temperature, non-abrasive, non-chemical engineered thermoplastic purging compound, formulated to flow naturally through the machine. Two unique ingredients provide for a “dual power” cleaning experience. A non-melting but softening thermoplastic scrubs while a proprietary additive expands, removing any contamination without leaving behind a residue.
| Applications: |
Injection – cold and hot runners
Extrustion – profile, sheet, cast film & compounding |
| Temperature Range: |
290° F - 550° F (143° C - 287° C) |
| Types of Resins: |
PP, TPE, TPO, TPR, TPU & other low temperature resins |
| Minimum Clearance: |
.025 inch or .65 mm |
| Amount of Purge: |
1 to 2 times barrel capacity (actual amount needed depends on machine conditions) |
FEATURES & BENEFITS OF DYNA-PURGE® K
- Developed for color changes, resin changes, preventative machine maintenance, and before manual cleaning
- Excellent for purging through equipment with a minimum clearance of .025 inch (.65 mm) or greater
- Effective through a wide range of temperatures – 290°F to 550° F (143°C to 287°C)
- Easy to use – no process adjustment necessary – use at the resident resin processing temperature and RPM speed
- Non-abrasive, non-melting but softening thermoplastic, which thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the system
- Safe, non-hazardous, with no chemicals – ingredients are FDA compliant
- Heat stable – recommended during shutdown and start-up
- Low "cost-per-purge" – only small quantity needed to be effective
- No mixing required – simply use "as is"
- Unlimited shelf life
Dyna-Purge has been the top performing purging compound for almost 30 years! Our product line offers superior cleaning and economic value over in-house methods and other commercial purges. We invite you to sample Dyna-Purge at no charge, so you can prove it to yourself.
Please refer to “Suggested Purging Procedures” for processing information and “Grade Selection Guide” regarding additional products.
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